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US Patent Issued to SCREEN Holdings on July 21 for "Substrate processing method" (Japanese Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,416, issued on July 21, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing method" was invented by Tomohiro Tak... और पढ़ें


US Patent Issued to NGK INSULATORS on July 21 for "Wafer placement table" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,417, issued on July 21, was assigned to NGK INSULATORS Ltd. (Nagoya-City, Japan). "Wafer placement table" was invented by Seiya Inoue (Hand... और पढ़ें


US Patent Issued to Applied Materials on July 21 for "Apparatus for clamping a substrate on a mono-polar electrostatic chuck for deposition of photoresist films" (California, Oregon Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,418, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Apparatus for clamping a substrate on a mono-polar e... और पढ़ें


US Patent Issued to Applied Materials on July 21 for "Forming mesas on an electrostatic chuck" (California Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,419, issued on July 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Forming mesas on an electrostatic chuck" was invente... और पढ़ें


US Patent Issued to Tokyo Ohka Kogyo on July 21 for "Semiconductor device production method" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,420, issued on July 21, was assigned to Tokyo Ohka Kogyo Co. Ltd. (Kawasaki, Japan). "Semiconductor device production method" was invented ... और पढ़ें


US Patent Issued to Persimmon Technologies on July 21 for "Material-handling robot trajectory control" (Massachusetts Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,421, issued on July 21, was assigned to Persimmon Technologies Corp. (Wakefield, Mass.). "Material-handling robot trajectory control" was i... और पढ़ें


US Patent Issued to GLOBALWAFERS on July 21 for "Wafer carrier" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,422, issued on July 21, was assigned to GLOBALWAFERS Co. LTD. (Hsinchu City, Taiwan). "Wafer carrier" was invented by Chih-Yuan Chuang (Hsi... और पढ़ें


US Patent Issued to ERS ELECTRONIC on July 21 for "Shielding device for a chuck, corresponding chuck, and corresponding wafer prober assembly" (German Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,423, issued on July 21, was assigned to ERS ELECTRONIC GMBH (Germering, Germany). "Shielding device for a chuck, corresponding chuck, and c... और पढ़ें


US Patent Issued to SEMES on July 21 for "Lift pin assembly and substrate processing apparatus having same" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,424, issued on July 21, was assigned to SEMES Co. LTD. (Cheonan-si, South Korea). "Lift pin assembly and substrate processing apparatus hav... और पढ़ें


US Patent Issued to PROTEANTECS on July 21 for "Die-to-die connectivity monitoring with a clocked receiver" (Israeli Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,425, issued on July 21, was assigned to PROTEANTECS LTD. (Haifa, Israel). "Die-to-die connectivity monitoring with a clocked receiver" was ... और पढ़ें